Xinhaisen - 13 years ISO-certified photochemical etching expert
Specializes in semiconductor lead frames & precision metal components. Processes metal materials (stainless steel/copper/titanium) with ±0.01mm tolerance.
Key advantages:
- Fast prototyping
- 10M+ annual capacity
- Burr/stress-free production
- DFM analysis support
- Strict quality control
- Competitive MOQ options
- Global logistics solutions
Full-service solutions from design optimization to mass production. Submit designs for free DFM analysis.
Specifications:
| Material |
Brass Alloys |
| Brass Alloys |
+/-0.005mm |
| Shape |
Customized |
| Applications |
Semiconductor IC packaging |
| Technique |
Chemical etching, Plating, Stamping, Laser cutting |
| Feature |
No burrs, no broken point and clean |
Why use photo etching?
Photo etching is a very cost-effective alternative of stamping, laser cutting, punching or CNC machining when the thickness of metal parts is between 0.02mm to 1.5mm.
1. Cost-effective: no expensive molding tool required.
2. Fast sampling: sample within 2-3 days, not weeks.
3. High precision, micro and complex.
4. No additional cost for complexity.
5. Burrs and stress free, no sharp edge.
6. Mass production within days, not month.
7. Various material options: stainless steel, copper, brass, aluminum, alloys, titanium and so on.
8. No effect on material temper or magnetism.
How to etching lead frame from us?
1.Please send us your design.
We accept the following file formats: DWG, DXF, PDF, Step, Gerber, IGES, CorelDraw and Adobe Illustrator
2.Samples making lead time:3-10days
3.Express:By DHL,Fedex,TNT,around 3-7days.
Product Tags:
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Metal Chemical Etching Cooper LC Lead Frame For Semiconductor Images
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